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Intel researchers claim to be two years ahead with breakthrough PowerVia tech
Intel researchers claim to be a year ahead with breakthrough semiconductor packaging technology dubbed PowerVia.
What’s Intel up to here ..?
That brings up one more novel thing about how Sell and the Intel team figured out the PowerVia recipe. PowerVia will be introduced into Intel-manufactured silicon starting with the Intel 20A node, which enters production in 2024 (Intel 20A will also see the introduction of a new gate-all-around transistor design called RibbonFET; customers of Intel Foundry Services can benefit from both innovations in the subsequent Intel 18A node, arriving later in 2024).