So does that mean that once AKD1500 is manufactured that we'll join the Global Foundaries' FDX™ Network with the likes of Andes, Siemens, Cadence, Synopsys, SiFive, Fraunhofer and many others?
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FDX™ Network
The FDX™ Network, formerly called the FDXcelerator Partner Program, enables designers to accelerate time to market with cost-effective, differentiated semiconductor chips that harness the unique differentiated, power-saving, body-biasing and adaptive body-biasing features of the GlobalFoundries® (GF®) 22FDX® platform (built on 22 nm FD-SOI process technology).
By leveraging the FDX™ Network, partners and customers can harness collaborative innovation through optimized FDX™ resources to increase market share and take advantage of growth opportunities in automotive, industrial, consumer IoT, mobile, RF connectivity and networking applications.
Extensive range of FDX-optimized services & solutions enables differentiation that matters. Broad portfolio of validated IP blocks helps shorten design cycle and reduce risk.
View Product Brief
Get to market quicker
Streamline design, increase productivity and get products to market faster with a suite of 22FDX-optimized solutions, domain expertise and resources.
Simplify migration
The FDX™ Network makes moving to FD-SOI from bulk nodes easier and faster, enabling designers to harness the power and performance advantages of 22FDX® to develop differentiated, integrated solutions.
Minimize cost & risk
The FDX™ Network enables low-cost, low-risk and rapid prototyping for product/market validation, IP validation and device characterization through the GF multi project wafer (MPW) service.
Explore the program
To learn more about the FDX™ Network, contact us at
ecosystem_support-uc@globalfoundries.com.
Meet our FDX™ Network partners
- Ultra-low-power PMU IP in 22FDX®, 10+ PMU IPs provides more selection
- IPs in other GF processes are available, including proven eNVM IP
- Lowest power Gigasample-class data converter IP available in advanced GlobalFoundries technology
- Ideal for any high sample rate, low power applications
- Radiation-tolerant and radiation-hardened versions available
- Providers of advanced packaging, assembly and test development services
- 22FDX® platform support and baseline package qualifications. Package types anticipated to be qualified are:
- Flip chip – Chip Scale Package (FcCSP)
- Wafer level – Chip Scale Package, Fan Out- (WlCSP-FO)
- Wire Bond
- Analog Value Ltd. offers a family of dual ADC IPs in 22FDX® process with resolution ranging from 12b to 16b and sample rate from 5Msps to 50Msps
- The ADCs have very small area and power consumption
- Andes provides power-efficient, small-footprint 32-bit and 64-bit soft CPU IP cores implemented on GF’s 22nm FD-SOI (22FDX®) technology, especially well-suited for the IoT, edge computing and deep learning SoC design
- Andes provides a comprehensive ecosystem, including the most mature support for RISC-V processor cores
- ANSYS multiphysics simulation enables chip-package-system (CPS) success in 7nm FinFET, RFIC and 22FDX in AI, 5G, automotive and HPC applications
- Solve physically-coupled design challenges of power, thermal, variability, timing, electromagnetics and reliability across CPS
- ArterisIP interconnect IP accelerates timing closure for FDX-based designs, in applications from automotive ADAS and machine learning to small IoT processors
- ArterisIP FDX-based offerings include the Ncore Cache Coherent Interconnect IP with Ncore Resilience Package, FlexNoC Interconnect IP with FlexNoC Resilience Package and PIANO Timing Closure Package
- Providers of advanced packaging, assembly and test development services
- 22FDX® platform support and baseline package qualifications. Package types anticipated to be qualified are:
- Flip chip – Chip Scale Package (FcCSP)
- Wafer level – Chip Scale Package, Fan In – (WlCSP-FI)
- Wafer level – Chip Scale Package, Fan Out – (WlCSP-FO)
- Highly integrated IoT systems-on-chip comprising front ends, radios, mixed-signal, power management, PHY and modem
- Turnkey best-in-class full-chip RFIC and modem design services for clients’ system solutions
- Founded in 2010, Attopsemi Technology is dedicated to developing proprietary I-fuse™ OTP IP to all CMOS process technologies from 0.7um to 7nm and beyond.
- I-fuse™ OTP provides small size, high reliability, low program voltage, low power and wide temperature range to enable harsh applications such as automotive, 3D IC, and IoT applications.
- Body Bias floor planning via Genus™ design exploration
- FDX-tailored support for Voltus™ and Tempus™ solutions
- Leading provider of low-power certified IP solution for Wireless Connectivity standards (WiFi, Bluetooth, Thread, NB-IoT, GNSS etc.) for consumer and IoT applications
- Offers efficient AI & Deep Learning Processor IPs for Imaging and Computer Vision Edge IoT & Automotive Applications
- We offer ultra-low-power IP for next generations of hearables and wearables
- We are using FDX22nm due the highly optimized process node for these applications (SOI, BB, etc…)
- World-class radio/antenna advanced test and characterization facility, electromagnetic simulation and modeling from MHz to THz
- Intelligent mmWave phased array/MIMO integrated circuit, module, antenna, system-in-package, IP and R&D
- Offers a complete portfolio of configurable RISC-V based processor IP cores
- Provides a comprehensive processor development platform with full software toolchain support
- CoreHW is your one-stop custom ASIC solution partner
- CoreHW competences cover RF systems; RFIC; analog, mixed signal and digital; RF front-end and antennas
- CSEM is a supplier of design services and silicon IPs, recognized as a leader for very low-power ICs & systems, and a rich history & IP catalog in ULP digital, RFICs and embedded machine learning
- CSEM’s IcyTRX, best-in-class Bluetooth Low Energy silicon RF IP, is integrated in millions of chips worldwide