BRN Discussion Ongoing
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Quiltman
Regular
Thank you cosors. Glad you can find something useful from the info posted. Hope it helps you with your investments.
Yak52
I would also like to acknowledge the contribution and spirit in which TSE forum is conducted ... it helps ensure that we all focus on the company and it's accomplishments rather than the daily SP gyrations.
If I allow myself the luxury of projecting forward a couple of years, I expect the daily gyrations will be more in the vicinity of .50c a day ( representing 2% or some such value ), half of the current company Market Cap. If many of the LTH's here have managed to hold onto their shares, this will be serious personal $ movement on a daily basis. You will need to have a psychological strategy in place to hold your nerves!!
And this forum will be a large part of that strategy for me .... maintain focus on our tech, our customers, and not the market shenanigans.
IMO. GLTAH
buena suerte :-)
BOB Bank of Brainchip
Learning
Learning to the Top 🕵♂️
Thank you Ahboy for the transcript.
At the 15:47, after referring to Mercedes;
"and other vehicle manufacturers"
Did Rob just spill the bean/confirm. Brainchip is working with other vehicle manufacturers. (FORD) or thier could be more?
Its great to be a shareholder.
TechGirl
Founding Member
Some fun Thursday morning reading, article dated yesterday, doesn't mention BrainChip but relevant.
"satellites will process data themselves"
"Machine learning in space - The foundation of addressing these design challenges is to offload processing from the ground station and bring it on-board. Rather than sending data and images to Earth for processing – and introducing all the latency associated with this – satellites will process data themselves and send information about what that data means instead. This requires satellites to support AI capabilities in orbit, including object detection and image classification, to start."
"True unlimited on-orbit reconfigurability provides the software and hardware flexibility these systems need to implement and accelerate real-time AI capabilities"
"Space 2.0 promises an exciting future. The ability of the private sector to launch its own systems brings new vision to the industry. On-orbit processing will extend the capabilities of space-based systems into viable commercial applications that improve quality of life around the world. True unlimited on-orbit reconfigurability provides the software and hardware flexibility these systems need to implement and accelerate real-time AI capabilities. The move to organic packaging will enable the industry to onboard the processing and I/O required for next-generation systems. OEMs will enjoy the many benefits of design agility as it becomes easier to evaluate, design, adapt, and reuse space-based IP."
militaryembedded.com
June 22, 2022
AMD
AMD
LinkedInTwitterFacebookEmailMorePrint
Consider SpaceX’s low-Earth orbit constellation of satellites to provide broadband connectivity. Because these satellites require less fuel to get into orbit and are less expensive to launch, they can deliver value while having a shorter expected lifecycle of just four or five years. In this time, technology will have advanced and the next generation of satellites will be ready to replace them.
Emerging trends
The tremendous interest in low-Earth-orbit constellations goes well beyond simply connecting the world’s seven billion-plus people. There are countless applications possible with this technology. Using a traditional satellite can take up to a month to process an image. In contrast, a constellation of smaller craft can provide real-time imaging that can be used immediately to help firefighters on the ground, detect and track objects like planes using hyperspectral cameras and synthetic aperture radar, or transform how users navigate the planet, just to name a few examples.
Low-Earth-orbit satellites also can mean shorter missions, which reduces risk and costs. Using satellites in this way means a possible increase in the overall pace of innovation in space, moving to newer process nodes and packaging technologies much earlier. When the payload can be updated every five years instead of every 10 to 20 years, this enables mission specialists to do more with less each successive generation.
Among the major trends is the rise of on-orbit processing, which requires more compute and input/output (I/O) slots; this, in turn, is driving the move toward organic BGA [ball-grid array] packaging and away from legacy technologies like ceramic column-grid-attach solutions. Also seen: a sharp increase in development agility, resulting in faster evaluation, prototyping, and the launch of new technology. (Figure 1.)
[Figure 1 | On-orbit processing requires more compute and I/O, which means a shift in packaging requirements.]
Challenges of designing for space
Operating in space presents some of the most challenging barriers to design: First, the environment is extreme and unforgiving, and systems must be ruggedized and designed for no single point of failure. Downtime for maintenance is not an option in space. In addition, designers must deal with challenges such as:
[Figure 2 | The challenges of designing for space are detailed.]
Machine learning in space
The foundation of addressing these design challenges is to offload processing from the ground station and bring it on-board. Rather than sending data and images to Earth for processing – and introducing all the latency associated with this – satellites will process data themselves and send information about what that data means instead. This requires satellites to support AI capabilities in orbit, including object detection and image classification, to start.
A key part of making on-orbit processing viable is understanding that AI is an ever-changing field of research and that machine learning (ML) models require continual optimization. First, ML models can adapt over time to become faster and more accurate. Second, the algorithms themselves change as new breakthroughs are made. Thus, space-based systems need a flexible and adaptive architecture that can change models and algorithms “on the fly.”
Because ML is involved, programmable software is not enough. ML is compute-intensive and requires hardware acceleration to provide real-time responsiveness. When the algorithms change, the hardware needed to accelerate the algorithms change as well. Thus, an adaptive platform requires a combination of configurable software and hardware that can update in concert with each other. In short, to support on-orbit processing, systems need to be able to process, analyze, and reconfigure from the architecture up through to the application code.
Moving toward organic packaging
Being able to deliver reliable system components that will operate during the long mission life needed and the extreme environments found in space require a completely different level of design, manufacturing, and testing. Quality control must work with design teams from the very start to achieve the levels of reliability required by the government.
For example, Six Sigma, an established and reliable leader in the defense and aerospace industry for over 30 years, is the sole supplier of solder column attachment to ceramic-grid-array packages, primarily used in space applications. While the government has actively sought out a second source, the processes and expertise required to provide the world-class reliability offered by Six Sigma are so rigorous that, to date, no other supplier has been able to achieve certification.
As the industry moves toward new process nodes like 7 nm technology, the dies are too large for legacy space-grade packaging and techniques like solder column attachment. Simply put, the processing requirements for on-orbit AI won’t fit anymore. There’s also the significant increase in I/O to consider.
As a result, the industry is beginning to move away from legacy packaging and to organic packing and flip-chip packaging for space-grade products. In addition to being able to support the larger die size and I/O needed, organic packaging reliability has been proven in the commercial market and has a much wider ecosystem of support.
Of course, there are still challenges to overcome: Space development will not shift overnight. It takes years to qualify space-grade products, and the many legacy ecosystems in place will continue to need support. However, the defense sector is interested in having access to the latest technology, and the players understand that innovation means change.
Continued innovation in space-based design and systems
The defense and aerospace industries – as well as any company considering space-based applications – need technology that can provide the necessary performance, adaptability, and reliability for Space 2.0 applications. New technology alone is not enough, however. As systems become more complex, the difficulty in integrating components becomes more challenging. Even evaluating a simple ML platform can take weeks when developers must integrate components from multiple vendors themselves.
It’s critical to understand the demanding requirements developers face while building reliable systems for space.
True innovation and on-orbit reconfigurability will be possible with:
"satellites will process data themselves"
"Machine learning in space - The foundation of addressing these design challenges is to offload processing from the ground station and bring it on-board. Rather than sending data and images to Earth for processing – and introducing all the latency associated with this – satellites will process data themselves and send information about what that data means instead. This requires satellites to support AI capabilities in orbit, including object detection and image classification, to start."
"True unlimited on-orbit reconfigurability provides the software and hardware flexibility these systems need to implement and accelerate real-time AI capabilities"
"Space 2.0 promises an exciting future. The ability of the private sector to launch its own systems brings new vision to the industry. On-orbit processing will extend the capabilities of space-based systems into viable commercial applications that improve quality of life around the world. True unlimited on-orbit reconfigurability provides the software and hardware flexibility these systems need to implement and accelerate real-time AI capabilities. The move to organic packaging will enable the industry to onboard the processing and I/O required for next-generation systems. OEMs will enjoy the many benefits of design agility as it becomes easier to evaluate, design, adapt, and reuse space-based IP."
An evolution in the industry: Top trends for Space 2.0 - Military Embedded Systems
Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can...
An evolution in the industry: Top trends for Space 2.0
StoryJune 22, 2022
INDERJIT SINGH
AMD
MINAL SAWANT
AMD
LinkedInTwitterFacebookEmailMorePrint
Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.
There has never been a more exciting time to design for space. Developing and launching systems into space is no longer solely within the reach of governments. The innovation, agility, and vision of private enterprise are ushering in a whole new era: Space 2.0. The shape of space is expanding far beyond traditional defense and aerospace to an expansive range of practical – and profitable – applications.Consider SpaceX’s low-Earth orbit constellation of satellites to provide broadband connectivity. Because these satellites require less fuel to get into orbit and are less expensive to launch, they can deliver value while having a shorter expected lifecycle of just four or five years. In this time, technology will have advanced and the next generation of satellites will be ready to replace them.
Emerging trends
The tremendous interest in low-Earth-orbit constellations goes well beyond simply connecting the world’s seven billion-plus people. There are countless applications possible with this technology. Using a traditional satellite can take up to a month to process an image. In contrast, a constellation of smaller craft can provide real-time imaging that can be used immediately to help firefighters on the ground, detect and track objects like planes using hyperspectral cameras and synthetic aperture radar, or transform how users navigate the planet, just to name a few examples.
Low-Earth-orbit satellites also can mean shorter missions, which reduces risk and costs. Using satellites in this way means a possible increase in the overall pace of innovation in space, moving to newer process nodes and packaging technologies much earlier. When the payload can be updated every five years instead of every 10 to 20 years, this enables mission specialists to do more with less each successive generation.
Among the major trends is the rise of on-orbit processing, which requires more compute and input/output (I/O) slots; this, in turn, is driving the move toward organic BGA [ball-grid array] packaging and away from legacy technologies like ceramic column-grid-attach solutions. Also seen: a sharp increase in development agility, resulting in faster evaluation, prototyping, and the launch of new technology. (Figure 1.)
[Figure 1 | On-orbit processing requires more compute and I/O, which means a shift in packaging requirements.]
Challenges of designing for space
Operating in space presents some of the most challenging barriers to design: First, the environment is extreme and unforgiving, and systems must be ruggedized and designed for no single point of failure. Downtime for maintenance is not an option in space. In addition, designers must deal with challenges such as:
- Limited downlink bandwidth: A satellite can capture a lot of data; however, the pipe to Earth isn’t wide enough to send it all back.
- Faster time to market: The window for launching new products is shrinking as development expands beyond traditional defense and aerospace applications.
- Designed for reuse: Space-based systems are no longer one-and-done; they must now be platforms whose IP can be reused across multiple missions.
- Low latency and high bandwidth: For broadband communications to be viable, the system must have minimal latency with seamless and reliable connectivity. (Figure 2.)
[Figure 2 | The challenges of designing for space are detailed.]
Machine learning in space
The foundation of addressing these design challenges is to offload processing from the ground station and bring it on-board. Rather than sending data and images to Earth for processing – and introducing all the latency associated with this – satellites will process data themselves and send information about what that data means instead. This requires satellites to support AI capabilities in orbit, including object detection and image classification, to start.
A key part of making on-orbit processing viable is understanding that AI is an ever-changing field of research and that machine learning (ML) models require continual optimization. First, ML models can adapt over time to become faster and more accurate. Second, the algorithms themselves change as new breakthroughs are made. Thus, space-based systems need a flexible and adaptive architecture that can change models and algorithms “on the fly.”
Because ML is involved, programmable software is not enough. ML is compute-intensive and requires hardware acceleration to provide real-time responsiveness. When the algorithms change, the hardware needed to accelerate the algorithms change as well. Thus, an adaptive platform requires a combination of configurable software and hardware that can update in concert with each other. In short, to support on-orbit processing, systems need to be able to process, analyze, and reconfigure from the architecture up through to the application code.
Moving toward organic packaging
Being able to deliver reliable system components that will operate during the long mission life needed and the extreme environments found in space require a completely different level of design, manufacturing, and testing. Quality control must work with design teams from the very start to achieve the levels of reliability required by the government.
For example, Six Sigma, an established and reliable leader in the defense and aerospace industry for over 30 years, is the sole supplier of solder column attachment to ceramic-grid-array packages, primarily used in space applications. While the government has actively sought out a second source, the processes and expertise required to provide the world-class reliability offered by Six Sigma are so rigorous that, to date, no other supplier has been able to achieve certification.
As the industry moves toward new process nodes like 7 nm technology, the dies are too large for legacy space-grade packaging and techniques like solder column attachment. Simply put, the processing requirements for on-orbit AI won’t fit anymore. There’s also the significant increase in I/O to consider.
As a result, the industry is beginning to move away from legacy packaging and to organic packing and flip-chip packaging for space-grade products. In addition to being able to support the larger die size and I/O needed, organic packaging reliability has been proven in the commercial market and has a much wider ecosystem of support.
Of course, there are still challenges to overcome: Space development will not shift overnight. It takes years to qualify space-grade products, and the many legacy ecosystems in place will continue to need support. However, the defense sector is interested in having access to the latest technology, and the players understand that innovation means change.
Continued innovation in space-based design and systems
The defense and aerospace industries – as well as any company considering space-based applications – need technology that can provide the necessary performance, adaptability, and reliability for Space 2.0 applications. New technology alone is not enough, however. As systems become more complex, the difficulty in integrating components becomes more challenging. Even evaluating a simple ML platform can take weeks when developers must integrate components from multiple vendors themselves.
It’s critical to understand the demanding requirements developers face while building reliable systems for space.
True innovation and on-orbit reconfigurability will be possible with:
- 2.5/3D die integration and packaging technology
- Chiplet and chip-to-chip (C2C) interconnect technology
- AI engines and domain-specific architectures
- Next-generation routing to eliminate congestion
- ASIC-like clocking with flexible clock placement and skew balancing
- Intelligent 3D analytical placing tools to optimize timing, congestion, and wire length
- Soft-core processors supported by tools for ML-centric applications
DingoBorat
Slim
My thoughts exactly Rocket.
What a joke, someone comes on here, with a product in development, expressing grave concern of competition!
What is really low, is the made up story of her mother's situation, in an attempt to attract compassion.
It has since been worked out that "Nessie" from HC, did have an unwell mother, but that does not mean that she is who she claims to be here.
The timing with the shorting. The fact it was "her" first post here.
A "Russian A.I. Chip" posing a threat, to Western markets?
Worried about something Shareman said.
Saying they'd been shareholders for "about 10 years" (before even the AZK reverse takeover) ie no shares.
If they really had been in since the beginning, they would not be concerned about a Russian chip "in development".
Are all and remain red flags to me, as to her integrity as an "actual person".
I may cop some flak for this assessment, as being insensitive, but I've seen this tactic before and it's as low as you can go.
Shorters are showing the lowest forms of desperation now..
My opinions only!
Last edited:
D
Deleted member 118
Guest
Missed a fair bit when I was working away, but going on what I did read regarding Sony and Honda I’ve found a few articles to read
www.iotworldtoday.com
Sony, Honda Form New Company for Advanced Mobility Services
Automated driving is almost certain to be part of its offering
D
Deleted member 118
Guest
No flak from me and I’m always happy to be corrected if wrong.
N
Neesie71
Guest
Thank you for taking time FF to reply. I have tried to encourage mum to use this forum but she is 75 and set in her ways so I try to read in here to let her in on the good stuff. Right now reading about her investments keeps her mind active and distracts her from her situation. She loves share trading with a passion and it puts a sparkle in her eyes. We're all devoting or time to her but she always likes to keep reading and staying in the loop. I can honestly say it's probably kept her alive way longer than she should have. She respects you highly and from the bottom of my heart I appreciate what you all have to offer. Mum has been my mentor and my rock so I will continue to read in here and do my own research to carry on my mum's legacy and her love of Brainchip which she discovered herself over a decade ago. From my mum to you all Thank you and Akida Ballista x
N
Neesie71
Guest
Thank you so much
buena suerte :-)
BOB Bank of Brainchip
Just searched Neesie71 on HC and has contributed a lot of positive comments ?
neesie71
82 Posts.
50
13/01/22
10:44
Post #: 58835681
Share
BRN Price at posting: $1.39 Sentiment: Buy Disclosure: Held
neesie71
82 Posts.
50
24/12/21
03:59
Post #: 58498505
Share
BRN Price at posting: 65.0¢ Sentiment: Buy Disclosure: Held
81 Upvote
6Great analysis
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DingoBorat
Slim
What makes you think it's confirmation jtardif?That is it, first confirmed Renesas product. Thanks @uiux for the confirmation and @Makeme 2020 for finding this. Fantastic and probably not the only product they will release with Akida inside, but break open the champagne - we’ve been waiting a while
The ultralow power used for keyword spotting?
That's what stood out to me and the fact that Uiux tried to push the idea in a few posts, despite not wanting to spoon feed us and elaborate at all about his reasons (and I suspect there may be a reason for that..).
I'm really surprised, that there has been no large reaction to this news, if the DA1470x, does indeed include AKIDA IP, as this would be the first available commercial product we know of?
Is everybody numbed, by all the leads and dots?
buena suerte :-)
BOB Bank of Brainchip
neesie71
82 Posts.
50
03/12/21
12:33
Post #: 58057154
Share
BRN Price at posting: 69.5¢ Sentiment: Buy Disclosure: Held
Fact Finder
Top 20
As I am on a blood thinner until stents are absorbed it’s no alcohol but end of July they finish so I will be able to pursue this cure to prevent a recurrence.
And to think I have wasted all these years seeing doctors when what I needed was an engineer.
FFAKIDA BALLISTA
D
Deleted member 118
Guest
Fair play, but nothing stopping a person from picking a name out of the hat and I just say it as it see it, knowing well that everyone wants to say the same but can’t, but then again I’ve always been the one that gets into trouble for speaking out
Last edited by a moderator:
buena suerte :-)
BOB Bank of Brainchip
So definitely Dry July for you then! :-(As I am on a blood thinner until stents are absorbed it’s no alcohol but end of July they finish so I will be able to pursue this cure to prevent a recurrence.
And to think I have wasted all these years seeing doctors when what I needed was an engineer.
AKIDA BALLISTA
GazDix
Regular
Absolutely agree Quiltman.
I already have accustomed myself from my first intial $1000 buy in Brainchip in 2019 and the 'volatility' in everyday trading from there to a position in which I have accumulated many more shares and large swings in the price and my portfolio value in general.
Psychologically I am not bothered about the price going down which may sound strange. I know the forces at work doing this and I just see it as an opportunity to accumulate more. Brainchip is one of the very few companies I have held in which I haven't really found a flaw fundamentally which it comes to management and leadership, explosive potential, at the cusp of commercialisation, competitor risk (since the Renenas IP contract) and many other aspects I find important for an investment.
What I worry about and need to check is my greed. I have controlled it very well so far and sold a tiny amount only at the large $1's in the last spike to just know I took an opportunity more than anything. I like many here saw it come right down to these prices and felt regret a bit. But it is not really regret. It is my greed and I am being as diligent as I can because I know my time horizon is at least half a decade.
But seeing a large jump at 10% of your investment go up in a day and thinking I can just take that profit now and be happy is so tempting. But I don't. I cannot imagine 50 cent swings. It will be insane. I want to see that and still not bow down to temptation. Grow those balls! There are retail holders who held companies like BHP for decades and have never sold. Dividends is the dream. Hope is real. I wish I could get that wand thing in Men in Black, forget about my Brainchip investment and get all those memories again after 5 years (with password access to my trading account of course as well!)
Anyway, I think it is important for us to reflect on our psychological state when investing.
buena suerte :-)
BOB Bank of Brainchip
Very true
Fact Finder
Top 20
Hi @Neesie71
Well give your mum our best and tell her that we all feel so much more in control and relaxed here rather than on HC and you would never know reading here that the world was in turmoil.
I will personally never post there again.
Regards
FF
AKIDA BALLISTA
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