Bosch is preparing for the increasing demand for special semiconductors
Released November 15, 2022
The growth on the world market for #semiconductors is unbroken - and we at Bosch are growing with it. For #Automotive Semiconductors alone, IHS Markit expects compound annual growth of 12 percent through 2028. In 2021, this part of the market was worth around $49 billion.
That is why we are consistently preparing for further growth.
In July 2022, we announced that we would make billions of euros in new investments in our own semiconductor business. At locations like #Dresden and #Reutlingen, these investments will enable us to set up new development centers in the coming years.
The main drivers of this growth are semiconductors for electrified and automated driving.
Expansion of our engineering and manufacturing network for semiconductors
Bosch is continuously expanding its #manufacturing to meet the increasing customer demand. The 300 mm wafer fab in Dresden, which went into operation in 2021, is expanding its clean room area after just one year. The existing clean room areas for 200 mm wafers at the Reutlingen site are also being greatly expanded. In #Malaysia, the new test center in #Penang will be completed in 2023; the existing test center in #Suzhou , #China , was expanded in 2021.
Bosch manufactures electronic components for vehicles and consumer electronics. These include microelectromechanical systems (MEMS), application specific integrated circuits (ASICs) and power semiconductors.
We want to continue to be a leading supplier of key products for the automotive and consumer electronics industries. Therefore, in addition to our manufacturing activities, we are also consistently expanding our #development capacities in the areas of integrated circuits, systems-on-a-chip (SoCs), micromechanical sensors and power semiconductors. Through our active participation in numerous specialist committees and publicly funded projects, we help shape the markets of the future.
Premiere of innovative semiconductor solutions at electronica
CAN XL protocol controller: The IP module "X_CAN" is a new CAN XL protocol controller for integration into microcontrollers. CAN XL enables data transmission rates of up to 20 Mbit/s in CAN networks.
Compact power modules made of silicon carbide (CSL): The new CSL line for electric powertrains covers various power classes, connection technologies and cooling concepts.
TPMS sensor module: With a new TPMS sensor module, manufacturers of tire pressure monitoring systems (TPMS) can now offer Bluetooth transmission of tire pressure and temperature.
MEMS sensors: In consumer electronics, Bosch is presenting the BME688, the world's most compact 4-in-1 air quality sensor with integrated artificial intelligence, the BMP581 barometric pressure sensor, which measures altitude changes with centimeter accuracy, and the new BMI323 inertial sensor for a wide range of measurement applications.
You can find more information here:
www.bosch-semiconductors.com/events/electronica-2022.html
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