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We are wondering if you START TO RUN AGAIN SOON!!!!! Ma’am!!I wonder if we're involved in this? Is it mere co-incidence that our latest patent covers anomaly detection? And when you click on the link at the very end of the article it takes you to this Edge Impulse page mentioning " the latest neural accelerators" (see below).
At any rate, if I was Edge Impulse, I'd be trying to capitalise as much as possible on our relationship. If they bought a licence from us, couldn't they sell the low-power systems as a product? I suppose that's what I'd do, if I was smart.
And, didn't we do something previously with them with FOMO and object detection?
Edge Impulse Brings Anomaly Detection to Any Edge Device
June 6, 2024
Edge Impulse, a platform for building, refining and deploying machine learning models to edge devices, has unveiled a novel technology for unlocking visual anomaly detection on any edge device, from NVIDIA GPUs to Arm MCUs, through the first model architecture of its kind: FOMO-AD (Faster Objects, More Objects – Anomaly Detection).
The demand for edge-capable AI software has increased as a path to innovating factories and production lines, with on-device computing allowing faster access to critical data insights, low latency, and more robust security and privacy compliance.
Visual anomaly detection in particular is an important use case for industrial AI, but is not widely used as it requires creating a library of known anomalous samples to train the model to spot deviations in industrial environments. Companies cannot collect real-world samples for every anomaly, especially for unanticipated defects, limiting detection capabilities.
Increased Productivity of Visual Inspection
Edge Impulse’s FOMO-AD architecture, two years in development, offers the first widely accessible platform for visual anomaly detection on any edge device, from GPUs to MCUs. It is also the first scalable system capable of training models on an optimal state to detect and catalog anything outside that baseline as an anomaly in video and image data. This dramatically increases the productivity of visual inspection systems that will no longer have to be manually trained on anomalous samples before they can start generating real-time insights on-device.
“Virtually every industrial customer that wants to deploy computer vision really needs to know when something out of the ordinary happens,” said Jan Jongboom, co-founder and CTO at Edge Impulse. “Traditionally that’s been challenging with machine learning, as classification algorithms need examples of every potential fault state. FOMO-AD uniquely allows customers to build machine learning models by only providing ‘normal’ data.”
Most industrial camera systems capable of computer vision are powered by GPUs and CPUs, with a high install cost that requires wiring and a power-hungry connection to mains electricity. Recent advancements from top-of-the-line silicon manufacturers, and novel edge model architectures from companies like Edge Impulse, enable computer vision AI models to operate in either high- or low-power systems, giving businesses more choice. The benefits of low-power systems include the possibility of building battery-powered visual inspection systems, and lower production costs from using cost-effective hardware that can reduce the overall product form factor.
In recent months, Edge Impulse has been testing FOMO-AD with customers, achieving proven results in industrial environments when proactively detecting irregularities in multiple production scenarios. Use of FOMO-AD has led to marked improvements in machine performance and production line efficiencies for customers.
There are many manufacturing use cases for visual anomaly detection, including:
Industrial: Production line inspection, quality control monitoring, defect detection
Automotive: Part assembly quality control, crack detection, leak detection, EV battery inspection, painting and surface defect detection
Silicon: IC inspection, PCB defect detection, soldering inspection
Medical: Medical device inspection, pill inspection, vial contamination inspection, seal inspection
For more information: www.edgeimpulse.com
Edge Impulse Brings Anomaly Detection to Any Edge Device – Metrology and Quality News - Online Magazine
Edge Impulse’s FOMO-AD architecture offers accessible platform for visual anomaly detection on any edge device.metrology.news
Here's what the link shows.
View attachment 65141
By the way we are wondering as well if we are integrated in so many other things
At MediaTek, we are building a future of ubiquitous AI. This includes Generative AI that can be processed "at the edge"
Instead of relying on the cloud and risking unguaranteed internet connectivity, or expensive services that can see and even take control of your data, the generative content is processed right inside your smartphone, tablet, smart TV, or vehicle.
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Smoothsailing
Regular
There is something about these chiplets that will become ubiquitous imo
PROPHESEE on LinkedIn: EventPS: Real-Time Photometric Stereo Using an Event Camera
[COMMUNITY] 🏆 Congratulations to the brilliant team behind the paper "EventPS: Real-Time Photometric Stereo Using an Event Camera" for receiving an Honorable…
supersonic001
Regular
BrainChip on LinkedIn: Edge AI is revolutionizing Smart Industrial operations by enabling…
Edge AI is revolutionizing Smart Industrial operations by enabling predictive maintenance, remote monitoring, and the optimization of manufacturing processes…
.
Frangipani
Top 20
Baya Systems, the company our former CMO Nandan Nayampally now works for as CCO, emerged from stealth mode today.
Chairman of the Board is Tenstorrent’s CEO Jim Keller.
www.eenewseurope.com
By Nick Flaherty
The company has executive from Intel, Netspeed Systems, ARM, Brainchip, AMD and Nuvia and is chaired by microprocessor expert Jim Keller, who is also CEO of AI chip developer Tenstorrent. It is backed by Matrix and Intel Capital.
“We focus on the data driven generation of IP with both static and dynamic microarchitectural analysis at runtime,” said Nayampally. “When you do complex systems, the devil is in the detail and system fabric is not that easy.”
The WeaveIP provides components to build a unified fabric that has an efficient, scalable transport architecture that maximizes performance and throughput, while minimizing latency, silicon footprint and power. This supports standard protocols such as CHI, ACE5-Lite, AXI5 and extendable to others including CXL.
The WeaverPro tool supports the SoC designer from initial specification all the way to post-silicon tuning. This uses the WeaveIP to produce a unified mesh fabric approach to generating layer protocols on top of the fabric without the need for gaskets that translate the protocols and the bottlenecks that come with this and slow down the performance.
“The transport is common so you can customise that for the QoS or debug protocols and build protocols on top.”
This comes from the software-driven analysis of the design that can configure up to eight virtual channels across the chip at runtime.
“What we do with our software is very efficient cache memory analysis, get accurate partitioning and caching, and a fabric component that generates a correct by construction physical design. We have two main flavours, where you can define your own protocol and one with multicast for AI designs,” he said.
“We can optimise the bandwidth and reduce the wires and logic to use those wires efficiently for optimising for latency and bandwidth, with up to 3GHz in a 4nm process.”
The fabric is customisable at runtime with APIs so you can tune the parameters for efficiency. “In general the flexibility we have put in helps overall with the reduction in silicon footprint and power and that comes from having an accurate understanding of the data movement,” he said.
The fabric is designed for inside the chip and the chiplet, and Baya will work with interconnect schemes such as Eliyan’s Bunch of Wires and UCIe.
“We stop at the die boundaries but what we end up doing outside of that is the software understands chiplet boundaries and can optimise across chiplet boundaries. So it’s a chiplet-ready network, as various things need to be built into the network to make it easier to use in chiplets,” he said.
“Our first partner is Blue Cheetah. They do the link layers, and once we understand their wires we can optimise and allow API tuning in the future as well,” said Nayampally
“The semiconductor industry is at an inflection point in how to overcome the widening gap between memory performance and the processing needs of AI,” said Dr. Sailesh Kumar, CEO at Baya Systems.
“These challenges are overwhelming the industry with design complexity, energy costs, and systems that are obsolete by the time they hit the market. Baya Systems is resolute in delivering foundational software, an industry-first, grounds-up fabric solution for future-proof multi-cluster and multi-chiplet designs, and a methodology that takes out the guesswork. I firmly believe that Baya unlocks the merchant chiplet market that is expected to grow to $107 billion by 2033.”
www.bayasystems.com
bayasystems.com
Go to...
Software and IP addresses system design complexity, performance, scalability and Time to Market of SoCs and chiplets for emerging applications.
Santa Clara, CALIF. – June 20, 2024 – Baya Systems today emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and multi-die SoC designs. These innovations bolster the emerging chiplet economy and enable unprecedented scale for large-scale compute and AI processing.
Baya Systems technology simplifies the development process and reduces the risk, empowering designers to rapidly analyze, develop, optimize and deploy these complex systems. This enables highly energy-efficient data movement in single-die designs that can support over 4 terabyte/second throughput in a complex CPU cluster, culminating in multi-petabyte/second throughput in multi-chiplet designs for high-end AI installations.
With the exponential growth of computing requirements for artificial intelligence, best-in-class silicon vendors have consistently tried to scale performance efficiently by integrating various processors, including CPUs, GPUs, and neural network accelerators, into intelligent compute systems. This has led to a substantial challenge of efficient data movement across these different processors, and increasingly complex system and application software development. Baya Systems focuses on delivering hyper-efficient data movement that can be customized with efficient hardware-based coherency, correctness, and robustness to accelerate these platforms for applications across industries such as AI acceleration, data center, networking infrastructure, automotive and IoT.
“The rapid scaling in compute needed to support AI is bottlenecked by scaling silicon, memory, storage, and the increasingly huge amounts of data; requiring increasingly complex SoCs and chiplets,” said Kevin Krewell, Principal Analyst at TIRIAS Research. “The industry desperately needs a holistic way to design, analyze, and build intelligent fabrics to address this, and Baya seems to have the right ingredients to really drive the market forward.”
Baya Systems tackles the challenges of system design complexity, performance guarantees, high costs, and shrinking market windows in the SoC and chiplet industries. Its WeaverPro™ software platform supports the SoC designer from initial specification all the way to post-silicon tuning. Its WeaveIP™ provides components to build a unified fabric that has an extremely efficient, scalable transport architecture that maximizes performance and throughput, while minimizing latency, silicon footprint and power. Combined with advanced features for reliability and safety, this empowers designers to analyze, architect, customize, optimize and deploy complex SoCs and chiplets.
Baya’s solution is unique for the following reasons:
“The semiconductor industry is at an inflection point in how to overcome the widening gap between memory performance and the processing needs of AI,” said Dr. Sailesh Kumar, CEO at Baya Systems. “These challenges are overwhelming the industry with design complexity, energy costs, and systems that are obsolete by the time they hit the market. Baya Systems is resolute in delivering foundational software, an industry-first, grounds-up fabric solution for future-proof multi-cluster and multi-chiplet designs, and a methodology that takes out the guesswork. I firmly believe that Baya unlocks the merchant chiplet market that is expected to grow to $107 billion by 2033.”
Baya Systems was founded by Kumar, an ex-Intel Fellow and former founder of Netspeed Systems; Dr. Eric Norige, and Joji Philip, who were also key contributors at Netspeed Systems. It is backed by leading investors Matrix and Intel Capital, and is led by Silicon Valley semiconductor veterans with extensive experience in processing and systems, who have driven important initiatives at AMD, ARM, Apple, Intel, Meta, and other leading processor companies.
“When we invest, we look for key market gaps, disruptive technologies that address them, and teams that have a compelling vision and execution muscle and the hunger to achieve it,” said Stan Reiss, general partner, Matrix Partners. “Baya tops all of them for a market that is desperate for solving the scale and chiplet problem with a technology that not just fills the gap but unleashes disruptive innovation, and a proven team that has had a consistent out-sized success in entrepreneurial and high-growth settings.”
The company makes its public debut at DAC 2024, Booth No. 2446, at Moscone West in San Francisco June 23-27.
About Baya Systems
Baya Systems is accelerating the next wave of foundational chiplet-based, high-performance and modular semiconductor systems technologies to accelerate intelligent compute everywhere. Baya Systems was named for the Baya bird, aka the weaver, renowned for constructing cohesive nests from various materials. This approach mirrors Baya Systems’ integrated and efficient solutions from diverse components, and its mission to allow best-of-breed compute, communication and I/O components to be used together with the promise of improving performance, yield, reusability/composability and cost of development. Baya Systems is backed by leading investors Matrix Partners and Intel Capital. For more information visit https://bayasystems.com.
Chairman of the Board is Tenstorrent’s CEO Jim Keller.
Baya Systems emerges from stealth with chiplet interconnect - update
Baya Systems has emerged from stealth with an interconnect tool for chiplet and complex system on chip (SoC) designs.
www.eenewseurope.com
Baya Systems emerges from stealth with chiplet interconnect
Technology News | June 20, 2024By Nick Flaherty
Baya Systems has emerged from stealth with an interconnect tool for chiplet and complex system on chip (SoC) designs.
“What we feel we bring to the table is a more software driven development process,” Nandan Nayampally, chief commercial officer of Baya Systems tells eeNews Europe. “We consider this to be the first really focussed fabric for AI.”The company has executive from Intel, Netspeed Systems, ARM, Brainchip, AMD and Nuvia and is chaired by microprocessor expert Jim Keller, who is also CEO of AI chip developer Tenstorrent. It is backed by Matrix and Intel Capital.
“We focus on the data driven generation of IP with both static and dynamic microarchitectural analysis at runtime,” said Nayampally. “When you do complex systems, the devil is in the detail and system fabric is not that easy.”
The WeaveIP provides components to build a unified fabric that has an efficient, scalable transport architecture that maximizes performance and throughput, while minimizing latency, silicon footprint and power. This supports standard protocols such as CHI, ACE5-Lite, AXI5 and extendable to others including CXL.
The WeaverPro tool supports the SoC designer from initial specification all the way to post-silicon tuning. This uses the WeaveIP to produce a unified mesh fabric approach to generating layer protocols on top of the fabric without the need for gaskets that translate the protocols and the bottlenecks that come with this and slow down the performance.
“The transport is common so you can customise that for the QoS or debug protocols and build protocols on top.”
This comes from the software-driven analysis of the design that can configure up to eight virtual channels across the chip at runtime.
“What we do with our software is very efficient cache memory analysis, get accurate partitioning and caching, and a fabric component that generates a correct by construction physical design. We have two main flavours, where you can define your own protocol and one with multicast for AI designs,” he said.
“We can optimise the bandwidth and reduce the wires and logic to use those wires efficiently for optimising for latency and bandwidth, with up to 3GHz in a 4nm process.”
The fabric is customisable at runtime with APIs so you can tune the parameters for efficiency. “In general the flexibility we have put in helps overall with the reduction in silicon footprint and power and that comes from having an accurate understanding of the data movement,” he said.
The fabric is designed for inside the chip and the chiplet, and Baya will work with interconnect schemes such as Eliyan’s Bunch of Wires and UCIe.
“We stop at the die boundaries but what we end up doing outside of that is the software understands chiplet boundaries and can optimise across chiplet boundaries. So it’s a chiplet-ready network, as various things need to be built into the network to make it easier to use in chiplets,” he said.
“Our first partner is Blue Cheetah. They do the link layers, and once we understand their wires we can optimise and allow API tuning in the future as well,” said Nayampally
“The semiconductor industry is at an inflection point in how to overcome the widening gap between memory performance and the processing needs of AI,” said Dr. Sailesh Kumar, CEO at Baya Systems.
“These challenges are overwhelming the industry with design complexity, energy costs, and systems that are obsolete by the time they hit the market. Baya Systems is resolute in delivering foundational software, an industry-first, grounds-up fabric solution for future-proof multi-cluster and multi-chiplet designs, and a methodology that takes out the guesswork. I firmly believe that Baya unlocks the merchant chiplet market that is expected to grow to $107 billion by 2033.”
www.bayasystems.com
Baya Systems Introduces New Technology to Transform and Accelerate Intelligent Computing
Baya Systems Introduces New Technology to Transform and Accelerate Intelligent Computing Software and IP addresses system design complexity, performance, scalability and Time to Market of SoCs and chiplets for emerging applications. Santa Clara, CALIF. – June 20, 2024 – Baya Systems today...
bayasystems.com
Go to...
Baya Systems Introduces New Technology to Transform and Accelerate Intelligent Computing
Software and IP addresses system design complexity, performance, scalability and Time to Market of SoCs and chiplets for emerging applications.
Santa Clara, CALIF. – June 20, 2024 – Baya Systems today emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and multi-die SoC designs. These innovations bolster the emerging chiplet economy and enable unprecedented scale for large-scale compute and AI processing.
Baya Systems technology simplifies the development process and reduces the risk, empowering designers to rapidly analyze, develop, optimize and deploy these complex systems. This enables highly energy-efficient data movement in single-die designs that can support over 4 terabyte/second throughput in a complex CPU cluster, culminating in multi-petabyte/second throughput in multi-chiplet designs for high-end AI installations.
With the exponential growth of computing requirements for artificial intelligence, best-in-class silicon vendors have consistently tried to scale performance efficiently by integrating various processors, including CPUs, GPUs, and neural network accelerators, into intelligent compute systems. This has led to a substantial challenge of efficient data movement across these different processors, and increasingly complex system and application software development. Baya Systems focuses on delivering hyper-efficient data movement that can be customized with efficient hardware-based coherency, correctness, and robustness to accelerate these platforms for applications across industries such as AI acceleration, data center, networking infrastructure, automotive and IoT.
“The rapid scaling in compute needed to support AI is bottlenecked by scaling silicon, memory, storage, and the increasingly huge amounts of data; requiring increasingly complex SoCs and chiplets,” said Kevin Krewell, Principal Analyst at TIRIAS Research. “The industry desperately needs a holistic way to design, analyze, and build intelligent fabrics to address this, and Baya seems to have the right ingredients to really drive the market forward.”
Baya Systems tackles the challenges of system design complexity, performance guarantees, high costs, and shrinking market windows in the SoC and chiplet industries. Its WeaverPro™ software platform supports the SoC designer from initial specification all the way to post-silicon tuning. Its WeaveIP™ provides components to build a unified fabric that has an extremely efficient, scalable transport architecture that maximizes performance and throughput, while minimizing latency, silicon footprint and power. Combined with advanced features for reliability and safety, this empowers designers to analyze, architect, customize, optimize and deploy complex SoCs and chiplets.
Baya’s solution is unique for the following reasons:
- Software-driven architecture exploration helps optimize design to achieve performance guarantees based on built-simulator.
- Engine to generate representative workloads from traffic specification.
- Best-in-class, flexible network that can achieve 3GHz in a 4-nanometer process technology.
- Algorithmic optimization that supports reuse and minimizes silicon and power footprints without compromising performance.
- Industry’s first IP to offer multi-level cache coherency for single/multi-die systems, radically reducing costs of coherency across these large-scale systems.
- Customizable protocol and multicast capabilities for advanced AI and CPU acceleration that support petabyte-level throughput.
- Correct-by-construction design generation that radically reduces risk of failure.
- WeaveIP supports standard protocols such as CHI, ACE5-Lite, AXI5 and extendable to others including CXL.
- Physically aware flow with modularity and tiling support for ease of implementation
“The semiconductor industry is at an inflection point in how to overcome the widening gap between memory performance and the processing needs of AI,” said Dr. Sailesh Kumar, CEO at Baya Systems. “These challenges are overwhelming the industry with design complexity, energy costs, and systems that are obsolete by the time they hit the market. Baya Systems is resolute in delivering foundational software, an industry-first, grounds-up fabric solution for future-proof multi-cluster and multi-chiplet designs, and a methodology that takes out the guesswork. I firmly believe that Baya unlocks the merchant chiplet market that is expected to grow to $107 billion by 2033.”
Baya Systems was founded by Kumar, an ex-Intel Fellow and former founder of Netspeed Systems; Dr. Eric Norige, and Joji Philip, who were also key contributors at Netspeed Systems. It is backed by leading investors Matrix and Intel Capital, and is led by Silicon Valley semiconductor veterans with extensive experience in processing and systems, who have driven important initiatives at AMD, ARM, Apple, Intel, Meta, and other leading processor companies.
“When we invest, we look for key market gaps, disruptive technologies that address them, and teams that have a compelling vision and execution muscle and the hunger to achieve it,” said Stan Reiss, general partner, Matrix Partners. “Baya tops all of them for a market that is desperate for solving the scale and chiplet problem with a technology that not just fills the gap but unleashes disruptive innovation, and a proven team that has had a consistent out-sized success in entrepreneurial and high-growth settings.”
The company makes its public debut at DAC 2024, Booth No. 2446, at Moscone West in San Francisco June 23-27.
About Baya Systems
Baya Systems is accelerating the next wave of foundational chiplet-based, high-performance and modular semiconductor systems technologies to accelerate intelligent compute everywhere. Baya Systems was named for the Baya bird, aka the weaver, renowned for constructing cohesive nests from various materials. This approach mirrors Baya Systems’ integrated and efficient solutions from diverse components, and its mission to allow best-of-breed compute, communication and I/O components to be used together with the promise of improving performance, yield, reusability/composability and cost of development. Baya Systems is backed by leading investors Matrix Partners and Intel Capital. For more information visit https://bayasystems.com.
AARONASX
Holding onto what I've got
Here is hoping!
9to5google.com
Report: Google's switch to TSMC with Tensor G5 will unsurprisingly bring 3nm to Pixel
After a few generations with Samsung, Google is set to switch to TSMC for Tensor in 2025. Unsurprisingly, a new...
9to5google.com
Obviously it is a mistake!
SharesForBrekky
Regular
Even Brainchip's HQ has entered stealth mode
Who says they don't play hardball:
https://news.bloomberglaw.com/ip-law/google-settles-ai-chip-design-suit-that-had-sought-billions
Google Settles AI-Chip Suit That Had Sought Over $5 Billion
20240125https://news.bloomberglaw.com/ip-law/google-settles-ai-chip-design-suit-that-had-sought-billions
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Space Cadet
Regular
Happens every quarter prior to quarterly. No significant revenue it goes back down. Just waiting for the quarterly that brings in the revenue so can head higher.
SC
JoMo68
Regular
Have we ever established (or discussed) whether we have a relationship with MediaTek?
Bravo
If ARM was an arm, BRN would be its biceps💪!
Chiplets, chiplets everywhere!
And today Alphawave Semi just announced the successful tape-out of the industry's first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process.
www.electropages.com
What I find interesting is that in an article I posted previously #83,885 on neuromorphic engineering, Tony Chan Carusone, CTO at of Alphawave Semi comments on how good neuromorphic computing is at performing computations so efficiently.
One wonders if this leaves room for AKIDA to be incorporated in their chiplets?
Oh, and here's a screen-shot from their website!
awavesemi.com
Rob Telson also "liked" this AlpaWave Semi post about chiplets in April 2023.
And today Alphawave Semi just announced the successful tape-out of the industry's first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process.
Off-the-shelf chiplet for HPC and AI iinfrastructure
Latest News from the Electronics Industry - Electropages
What I find interesting is that in an article I posted previously #83,885 on neuromorphic engineering, Tony Chan Carusone, CTO at of Alphawave Semi comments on how good neuromorphic computing is at performing computations so efficiently.
One wonders if this leaves room for AKIDA to be incorporated in their chiplets?
Oh, and here's a screen-shot from their website!
The Era of Specialized Silicon - Alphawave Semi
Alphawave Semi Custom Silicon has custom designed products to fit a wide variety of industry needs. .
awavesemi.com
Rob Telson also "liked" this AlpaWave Semi post about chiplets in April 2023.
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