I think you are right. I think a lot of companies have invested in technology that only offers part of the solution they are seeking. With Akida they get the missing link, whatever that may be. They are adopting Akida but are reluctant to throw away the tech and marketing that they have spent mega dollars and time on.
And therein lies the beauty of AKIDA it can just slot in at the Edge. It can convert the customers existing networks from CNN to SNN and take advantage of everything AKIDA has to offer and save power and have real time learning on device.
As importantly the existing Chief Technical Officer does not have to explain to the CEO why to get the benefits of SNN technology they have to throw out the system costing $10 million 12 months ago to achieve these advantages like an early adopter competitor. It is a win, win for everyone and in fact handled the right way the Chief Technical Officer can take credit for reducing power etc; by recommending the addition of AKIDA.
The Brainchip team past and present have been very strategic in what they set out to achieve and are now able to market. They have blown up the normal resistance inherent in incumbency that stops the adoption of better technology solutions. Pure genius.
By the way in the first analyst report from Macquarie that was posted a few days ago they recognised a benefit inherent in the AKD1000 chip family. The extreme low heat generated by the AKIDA neural network has the side benefit of not destroying the chip as high heat generating old school technology chips can and as a result in Macquarie's words AKIDA chips will outlast the product in which they are installed. This might not be precisely correct however heat stress is a potential cause of failure particularly in military operations or harsh conditions think monitoring vibration on heavy rail in the Australian outback:
"Thermal overstress
Thermal overstress—excess heat—can cause semiconductors to fail. Excess heat melts materials, chars plastics, warps and breaks semiconductor dies, and causes other types of damage. In general, devices should not operate with a junction temperature above 125–150°C.
Military applications aim to limit junction temperature to 110°C. By applying the Arrhenius equation (see, “
Models Predict Failure Rates”), you can show that reducing a device’s junction temperature from 160°C to 135°C cuts the failure rate in half. (For a further explanation of the equation and how to solve it, see “
The Effect of Temperature on Failure Rate.”)
If high temperatures have caused a failure, notify the product’s designers.
They must take into account product packaging and operating specs to ensure that fans, heat sinks, and other cooling devices keep temperatures within spec. Although high-power devices require heat sinks and fans, low-power devices can simply distribute heat into the surrounding air. Also, test engineers must ensure that heat sinks and fans remain in place during testing or that other heat-removal devices are available to sufficiently cool a device undergoing testing.
Test engineers may have to monitor the temperature of power semiconductors and power assemblies to ensure they do not operate the devices at unsafe temperatures—and thus reduce their useful life—during testing."
My opinion only DYOR
FF
AKIDA BALLISTA