Hi
@Steve10 , have you come across this before in your TI travels?
TDK and TI have teamed up on an edge AI wireless module to detect anomalies in machinery and equipment for predictive maintenance
www.eenewseurope.com
TDK has teamed up with Texas Instruments on a compact, battery-powered wireless multi-sensor module that uses edge AI to detect anomalies in machinery and equipment.
The TDK i3 Micro Module integrates the TI SimpleLink CC2652R7 wireless chip, an ARM Cortex-M4F multiprotocol 2.4-GHz wireless 32-bit microcontroller (MCU) for real-time monitoring. The module also integrates TDKās IIM-42352 MEMS accelerometer and digital output temperature sensor, edge AI, and mesh network functionality into a single unit, facilitating data aggregation, integration, and processing.
The i3 Micro Module allows users to achieve sensing at most any desired position without physical constraints such as wiring by using a wireless mesh to connect up the modules in the network. This helps identify anomalies in machinery and equipment, enabling Condition-based Monitoring (CbM).
The accelerometer features digital-output X-, Y-, and Z-axis accelerometer with programmable full-scale range of Ā±2g, Ā±4g, Ā±8g, and Ā±16g, user-programmable interrupts, I3Cā / IĀ²C / SPI slave host interface, digital-output temperature sensor, an external clock input that supports highly accurate clock input from 31 kHz to 50 kHz, and 20,000g shock tolerance.
Monitoring through real-time visualized empirical equipment data instead of relying on manpower and scheduled maintenance
contributes to a a predictive maintenance system to minimize production downtime.
āAs more electronics and automation are being implemented in factories and buildings, companies are seeking more efficient ways to anticipate and manage equipment needs, avoiding expensive downtime,ā said Nick Smith, product marketing manager at Texas Instruments.
āThis collaboration between TI and TDK will bring more technology into factories and increase their efficiency through simpler and more powerful sensing and real-time communication. TIās connectivity technology is backed by over 20 years of experience to help drive innovations such as these modules.ā
āTDKās i3 Micro Module facilitates numerous benefits to the manufacturing floor to enable digital transformation and an enhanced smart factory environment,ā stated Christian Hoffman, General Manager, Corporate Marketing Group at TDK. āThe module simplifies the deployment and sensor data gathering process giving users the bandwidth to focus on effective condition based monitoring and predictive maintenance initiatives.ā
The i3 Micro Module is expected to be available through most global distribution partners by the fourth quarter of 2023.