Fullmoonfever
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Apols, bit later than thought.
Anyway, haven't had time to do a deep dive as just on and quick skim hasn't shown any official docs I can find with Akida spelt out but probs to be expected.
Was re-reading on my laptop now what I found when on my phone and actually it's maybe a little ambiguous.
Thoughts anyone? I know mine.
Was searching procurement / supply keyword variations and came across eX3 which is a funded Norwegian based research program around HPC / Exascale computing. Further down I'll explain my thinking.
The eX3 infrastructure is not an exascale computer by itself, but it is a carefully curated ecosystem of technology components that will be crucial for embracing exascale computing. It will allow HPC researchers throughout Norway and their collaborators to experiment hands-on with emerging HPC technologies – hardware as well as software."
So, this project has established procurement of various HW as part of their resources.
"The eX3 infrastructure is continuously under build-up and reconfiguration in order to keep up-to-date with the technology development. The following hardware resources, acquired in the first phase procurement, are currently available."
So, this is where it got interesting as part of their HW inventory is the Huawei TaiShan 200 server with the KunPeng 920 processor.
A bit further down was the Akida NPU details but referring to the above.
So, my first thinking was Huawei are using Akida in the KunPeng then reading again I'm wondering if it's something aftermarket that eX3 have added as part of their research?
I believe my first thoughts re Huawei are probs correct though.
Some additional snips and other links below I've started trying to get through.
Industry leading server ARM CPU..
The 920 also being looked at for DT boards...whether will inc Akida...who knows.
www.computer.org
Kunpeng 920 is the second generation server processor designed by HiSilicon based on ARM architecture. Kunpeng 920 is able to achieve cost efficiency for various workloads through using a variety of chiplets and hybrid process technologies. The unique recomposition(s) of these flexible chipsets allows new designs to be created. The Kunpeng series processors combine technology innovations from various levels to improve efficiency, eliminate bottlenecks, and deliver value and performance. Its key features are as follows: The Kunpeng 920 core is specifically designed with superscalar architecture with the support of vector extension to provide leading features for high-performance computing applications; the coherent cache subsystem is created to integrate multicores into single chiplet (e.g., 7-nm process node) with a ring design that is ultralow-latency (<; 15 ns), nonblocking and bufferless; a dedicated parallel small-IO block is developed to achieve high-bandwidth (e.g., 400 GB/s) interdie connection for 2-D package solutions; IO die is redesigned (e.g., 16-nm process) so that the latest standard interface (e.g., PCI4.0) can be leveraged to scale up the System on a Chip (SoCs) and connect them with other IO devices; two or four Kunpeng 920 can work together as single symmetric multiprocessor system with cache coherent nonuniform memory access fabric.
www.codetd.com
www.huaweicloud.com
Anyway, haven't had time to do a deep dive as just on and quick skim hasn't shown any official docs I can find with Akida spelt out but probs to be expected.
Was re-reading on my laptop now what I found when on my phone and actually it's maybe a little ambiguous.
Thoughts anyone? I know mine.
Was searching procurement / supply keyword variations and came across eX3 which is a funded Norwegian based research program around HPC / Exascale computing. Further down I'll explain my thinking.
The eX3 project
"Together with partners, Simula Research Laboratory has established eX3 to become the previously missing national resource that can prepare researchers for exascale computing in Norway. The eX3 infrastructure is currently funded for five years through the RCN program for national research infrastructures. In addition to the host institution Simula, the project consortium also counts the national HPC management body Sigma2, HPC research groups from the University of Tromsø, NTNU, the University of Bergen, and OsloMet, as well as the HPC technology providers Graphcore, Dolphin Interconnect Solutions, and Numascale.The eX3 infrastructure is not an exascale computer by itself, but it is a carefully curated ecosystem of technology components that will be crucial for embracing exascale computing. It will allow HPC researchers throughout Norway and their collaborators to experiment hands-on with emerging HPC technologies – hardware as well as software."
So, this project has established procurement of various HW as part of their resources.
"The eX3 infrastructure is continuously under build-up and reconfiguration in order to keep up-to-date with the technology development. The following hardware resources, acquired in the first phase procurement, are currently available."
So, this is where it got interesting as part of their HW inventory is the Huawei TaiShan 200 server with the KunPeng 920 processor.
A bit further down was the Akida NPU details but referring to the above.
So, my first thinking was Huawei are using Akida in the KunPeng then reading again I'm wondering if it's something aftermarket that eX3 have added as part of their research?
I believe my first thoughts re Huawei are probs correct though.
Some additional snips and other links below I've started trying to get through.
Industry leading server ARM CPU..
The 920 also being looked at for DT boards...whether will inc Akida...who knows.
CSDL | IEEE Computer Society
www.computer.org
Kunpeng 920: The First 7-nm Chiplet-Based 64-Core ARM SoC for Cloud Services
Sept.-Oct. 2021, pp. 67-75, vol. 41Abstract
Kunpeng 920 is the second generation server processor designed by HiSilicon based on ARM architecture. Kunpeng 920 is able to achieve cost efficiency for various workloads through using a variety of chiplets and hybrid process technologies. The unique recomposition(s) of these flexible chipsets allows new designs to be created. The Kunpeng series processors combine technology innovations from various levels to improve efficiency, eliminate bottlenecks, and deliver value and performance. Its key features are as follows: The Kunpeng 920 core is specifically designed with superscalar architecture with the support of vector extension to provide leading features for high-performance computing applications; the coherent cache subsystem is created to integrate multicores into single chiplet (e.g., 7-nm process node) with a ring design that is ultralow-latency (<; 15 ns), nonblocking and bufferless; a dedicated parallel small-IO block is developed to achieve high-bandwidth (e.g., 400 GB/s) interdie connection for 2-D package solutions; IO die is redesigned (e.g., 16-nm process) so that the latest standard interface (e.g., PCI4.0) can be leveraged to scale up the System on a Chip (SoCs) and connect them with other IO devices; two or four Kunpeng 920 can work together as single symmetric multiprocessor system with cache coherent nonuniform memory access fabric.
[In-depth] Self-research trip of Huawei chips! - Code World
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