BRN Discussion Ongoing
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Damo4
Regular
Registered, but will just be an observer this time around.
davidfitz
Regular
I am unable to attend however wouldn't it be nice to know how many chips are available for the Edge Box. They are taking pre orders and payment is required upfront in full. It they have 2000 chips available (I think there are 2 in every box?) then it is not unreasonable to expect sales for this quarter to be approx. $800k. I know Sean/Board does not like to make such forecasts but what's the harm in asking
Someones trying hard to push us down but like
Ass monkeys
mrgds
Regular
Ive just had confirmation from TD that Dr Tony Lewis (CTO) will be presenting on tomorrows Virtual Roadshow alongside SH (CEO)
ive been wanting to hear from our new CTO for a while now.
Tothemoon24
Top 20
Telco ? , Special Sauce ?
apple.news
Optus, Ericsson join forces on energy savings
While results reveal November outage cost to the carrier.
Optus expects to save as much as 26 percent of the energy consumed by its radio access network, after deploying a range of energy efficiency solutions in conjunction with Ericsson.
The technologies are software tools called Massive MIMO Sleep mode, and Booster Carrier Sleep.
Massive MIMO Sleep lets radios hibernate when there’s no traffic, saving around 70 percent of the energy that would be consumed if the radios were fully active.
Booster Carrier Sleep allows the radio carriers to be switched on and off dynamically based on traffic.
The two companies are showing off the solutions at Mobile World Congress in Barcelona.
The software has been deployed at trial sites in Sydney and Melbourne, the companies said in a statement.
They said Massive MIMO Sleep mode is saving 2.5kWh per day, per site, while the Booster Carrier Sleep feature saves 2.23kWh per day, per site.
Combined with modernisation and enhancements completed during 2023, Optus and Ericsson said, daily energy savings at radio sites could reach between 24 percent and 26 percent.
“The enhancements made possible by the Ericsson Massive MIMO Sleep mode and Booster Carrier Sleep solutions are helping Optus take a step closer to our sustainability commitment to reduce our 2025 emissions by 25 percent, from a 2015 baseline and ensure network capacity and performance is maintained, even as power needs are minimised," managing director of networks Lambo Kanagaratnam said.
Optus, Ericsson join forces on energy savings — iTnews
While results reveal November outage cost to the carrier.
Optus, Ericsson join forces on energy savings
While results reveal November outage cost to the carrier.
Optus expects to save as much as 26 percent of the energy consumed by its radio access network, after deploying a range of energy efficiency solutions in conjunction with Ericsson.
The technologies are software tools called Massive MIMO Sleep mode, and Booster Carrier Sleep.
Massive MIMO Sleep lets radios hibernate when there’s no traffic, saving around 70 percent of the energy that would be consumed if the radios were fully active.
Booster Carrier Sleep allows the radio carriers to be switched on and off dynamically based on traffic.
The two companies are showing off the solutions at Mobile World Congress in Barcelona.
The software has been deployed at trial sites in Sydney and Melbourne, the companies said in a statement.
They said Massive MIMO Sleep mode is saving 2.5kWh per day, per site, while the Booster Carrier Sleep feature saves 2.23kWh per day, per site.
Combined with modernisation and enhancements completed during 2023, Optus and Ericsson said, daily energy savings at radio sites could reach between 24 percent and 26 percent.
“The enhancements made possible by the Ericsson Massive MIMO Sleep mode and Booster Carrier Sleep solutions are helping Optus take a step closer to our sustainability commitment to reduce our 2025 emissions by 25 percent, from a 2015 baseline and ensure network capacity and performance is maintained, even as power needs are minimised," managing director of networks Lambo Kanagaratnam said.
Fullmoonfever
Top 20
Whilst we don't get a direct mention and I get it, being the "new kid" on the block in their world, I do like some of the comments and see where we can piggy back and add value in the ecosystem of IFS and ARM in particular.
iconnect007.com
Estimated reading time: 4 minutes
Intel Corp. (INTC) launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade. The company also highlighted customer momentum and support from ecosystem partners – including Synopsys, Cadence, Siemens and Ansys – who outlined their readiness to accelerate Intel Foundry customers’ chip designs with tools, design flows and IP portfolios validated for Intel’s advanced packaging and Intel 18A process technologies.
The announcements were made at Intel’s first foundry event, Intel Foundry Direct Connect, where the company gathered customers, ecosystem companies and leaders from across the industry. Among the participants and speakers were U.S. Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI CEO Sam Altman and others.
More: Intel Foundry Direct Connect (Press Kit)
“AI is profoundly transforming the world and how we think about technology and the silicon that powers it,” said Intel CEO Pat Gelsinger. “This is creating an unprecedented opportunity for the world’s most innovative chip designers and for Intel Foundry, the world’s first systems foundry for the AI era. Together, we can create new markets and revolutionize how the world uses technology to improve people’s lives.”
Process Roadmap Expands Beyond 5N4Y
Intel’s extended process technology roadmap adds Intel 14A to the company’s leading-edge node plan, in addition to several specialized node evolutions. Intel also affirmed that its ambitious five-nodes-in-four-years (5N4Y) process roadmap remains on track and will deliver the industry’s first backside power solution. Company leaders expect Intel will regain process leadership with Intel 18A in 2025.
The new roadmap includes evolutions for Intel 3, Intel 18A and Intel 14A process technologies. It includes Intel 3-T, which is optimized with through-silicon vias for 3D advanced packaging designs and will soon reach manufacturing readiness.
Also highlighted are mature process nodes, including new 12 nanometer nodes expected through the joint development with UMC announced last month. These evolutions are designed to enable customers to develop and deliver products tailored to their specific needs. Intel Foundry plans a new node every two years and node evolutions along the way, giving customers a path to continuously evolve their offerings on Intel’s leading process technology.
Intel also announced the addition of Intel Foundry FCBGA 2D+ to its comprehensive suite of ASAT offerings, which already include FCBGA 2D, EMIB, Foveros and Foveros Direct.
Microsoft Design on Intel 18A Headlines Customer Momentum
Customers are supporting Intel’s long-term systems foundry approach. During Pat Gelsinger’s keynote, Microsoft Chairman and CEO Satya Nadella stated that Microsoft has chosen a chip design it plans to produce on the Intel 18A process.
“We are in the midst of a very exciting platform shift that will fundamentally transform productivity for every individual organization and the entire industry,” Nadella said. “To achieve this vision, we need a reliable supply of the most advanced, high-performance and high-quality semiconductors. That’s why we are so excited to work with Intel Foundry, and why we have chosen a chip design that we plan to produce on Intel 18A process.”
Intel Foundry has design wins across foundry process generations, including Intel 18A, Intel 16 and Intel 3, along with significant customer volume on Intel Foundry ASAT capabilities, including advanced packaging.
In total, across wafer and advanced packaging, Intel Foundry’s expected lifetime deal value is greater than $15 billion.
IP and EDA Vendors Declare Readiness for Intel Process and Packaging Designs
Intellectual property and electronic design automation (EDA) partners Synopsys, Cadence, Siemens, Ansys, Lorentz and Keysight disclosed tool qualification and IP readiness to enable foundry customers to accelerate advanced chip designs on Intel 18A, which offers the foundry industry’s first backside power solution.
These companies also affirmed EDA and IP enablement across Intel node families.
At the same time, several vendors announced plans to collaborate on assembly technology and design flows for Intel’s embedded multi-die interconnect bridge (EMIB) 2.5D packaging technology. These EDA solutions will ensure faster development and delivery of advanced packaging solutions for foundry customers.
Intel also unveiled an "Emerging Business Initiative" that showcases a collaboration with Arm to provide cutting-edge foundry services for Arm-based system-on-chips (SoCs). This initiative presents an important opportunity for Arm and Intel to support startups in developing Arm-based technology and offering essential IP, manufacturing support and financial assistance to foster innovation and growth.
Systems Approach Differentiates Intel Foundry in the AI Era
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards.
Stuart Pann, senior vice president of Intel Foundry at Intel said, “We are offering a world-class foundry, delivered from a resilient, more sustainable and secure source of supply, and complemented by unparalleled systems of chips capabilities. Bringing these strengths together gives customers everything they need to engineer and deliver solutions for the most demanding applications.”
Global, Resilient, More Sustainable and Trusted Systems Foundry
Resilient supply chains must also be increasingly sustainable, and today Intel shared its goal of becoming the industry’s most sustainable foundry. In 2023, preliminary estimates show that Intel used 99% renewable electricity in its factories worldwide. Today, the company redoubled its commitment to achieving 100% renewable electricity worldwide, net-positive water and zero waste to landfills by 2030. Intel also reinforced its commitment to net-zero Scope 1 and Scope 2 GHG emissions by 2040 and net-zero upstream Scope 3 emissions by 2050.
Intel Launches World’s First Systems Foundry Designed for the AI Era
Intel Corp. (INTC) launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade.
Intel Launches World’s First Systems Foundry Designed for the AI Era
February 22, 2024 | BUSINESS WIREEstimated reading time: 4 minutes
Intel Corp. (INTC) launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade. The company also highlighted customer momentum and support from ecosystem partners – including Synopsys, Cadence, Siemens and Ansys – who outlined their readiness to accelerate Intel Foundry customers’ chip designs with tools, design flows and IP portfolios validated for Intel’s advanced packaging and Intel 18A process technologies.
The announcements were made at Intel’s first foundry event, Intel Foundry Direct Connect, where the company gathered customers, ecosystem companies and leaders from across the industry. Among the participants and speakers were U.S. Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI CEO Sam Altman and others.
More: Intel Foundry Direct Connect (Press Kit)
“AI is profoundly transforming the world and how we think about technology and the silicon that powers it,” said Intel CEO Pat Gelsinger. “This is creating an unprecedented opportunity for the world’s most innovative chip designers and for Intel Foundry, the world’s first systems foundry for the AI era. Together, we can create new markets and revolutionize how the world uses technology to improve people’s lives.”
Process Roadmap Expands Beyond 5N4Y
Intel’s extended process technology roadmap adds Intel 14A to the company’s leading-edge node plan, in addition to several specialized node evolutions. Intel also affirmed that its ambitious five-nodes-in-four-years (5N4Y) process roadmap remains on track and will deliver the industry’s first backside power solution. Company leaders expect Intel will regain process leadership with Intel 18A in 2025.
The new roadmap includes evolutions for Intel 3, Intel 18A and Intel 14A process technologies. It includes Intel 3-T, which is optimized with through-silicon vias for 3D advanced packaging designs and will soon reach manufacturing readiness.
Also highlighted are mature process nodes, including new 12 nanometer nodes expected through the joint development with UMC announced last month. These evolutions are designed to enable customers to develop and deliver products tailored to their specific needs. Intel Foundry plans a new node every two years and node evolutions along the way, giving customers a path to continuously evolve their offerings on Intel’s leading process technology.
Intel also announced the addition of Intel Foundry FCBGA 2D+ to its comprehensive suite of ASAT offerings, which already include FCBGA 2D, EMIB, Foveros and Foveros Direct.
Microsoft Design on Intel 18A Headlines Customer Momentum
Customers are supporting Intel’s long-term systems foundry approach. During Pat Gelsinger’s keynote, Microsoft Chairman and CEO Satya Nadella stated that Microsoft has chosen a chip design it plans to produce on the Intel 18A process.
“We are in the midst of a very exciting platform shift that will fundamentally transform productivity for every individual organization and the entire industry,” Nadella said. “To achieve this vision, we need a reliable supply of the most advanced, high-performance and high-quality semiconductors. That’s why we are so excited to work with Intel Foundry, and why we have chosen a chip design that we plan to produce on Intel 18A process.”
Intel Foundry has design wins across foundry process generations, including Intel 18A, Intel 16 and Intel 3, along with significant customer volume on Intel Foundry ASAT capabilities, including advanced packaging.
In total, across wafer and advanced packaging, Intel Foundry’s expected lifetime deal value is greater than $15 billion.
IP and EDA Vendors Declare Readiness for Intel Process and Packaging Designs
Intellectual property and electronic design automation (EDA) partners Synopsys, Cadence, Siemens, Ansys, Lorentz and Keysight disclosed tool qualification and IP readiness to enable foundry customers to accelerate advanced chip designs on Intel 18A, which offers the foundry industry’s first backside power solution.
These companies also affirmed EDA and IP enablement across Intel node families.
At the same time, several vendors announced plans to collaborate on assembly technology and design flows for Intel’s embedded multi-die interconnect bridge (EMIB) 2.5D packaging technology. These EDA solutions will ensure faster development and delivery of advanced packaging solutions for foundry customers.
Intel also unveiled an "Emerging Business Initiative" that showcases a collaboration with Arm to provide cutting-edge foundry services for Arm-based system-on-chips (SoCs). This initiative presents an important opportunity for Arm and Intel to support startups in developing Arm-based technology and offering essential IP, manufacturing support and financial assistance to foster innovation and growth.
Systems Approach Differentiates Intel Foundry in the AI Era
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards.
Stuart Pann, senior vice president of Intel Foundry at Intel said, “We are offering a world-class foundry, delivered from a resilient, more sustainable and secure source of supply, and complemented by unparalleled systems of chips capabilities. Bringing these strengths together gives customers everything they need to engineer and deliver solutions for the most demanding applications.”
Global, Resilient, More Sustainable and Trusted Systems Foundry
Resilient supply chains must also be increasingly sustainable, and today Intel shared its goal of becoming the industry’s most sustainable foundry. In 2023, preliminary estimates show that Intel used 99% renewable electricity in its factories worldwide. Today, the company redoubled its commitment to achieving 100% renewable electricity worldwide, net-positive water and zero waste to landfills by 2030. Intel also reinforced its commitment to net-zero Scope 1 and Scope 2 GHG emissions by 2040 and net-zero upstream Scope 3 emissions by 2050.
Smoothsailing
Regular
BrilliantIve just had confirmation from TD that Dr Tony Lewis (CTO) will be presenting on tomorrows Virtual Roadshow alongside SH (CEO)
ive been wanting to hear from our new CTO for a while now.
Space Machines Company on LinkedIn: #optimusorbitalservicingvehicle #spaceinnovation #spaceindustry…
🚀 We're super excited as we look forward to the March launch of the Optimus Orbital Servicing Vehicle (OSV). It's a great moment to reflect on this journey…
Hi ILL,
This is an exciting find.
Fact Finder recently reminded us that Akida 2P was expanded from 80 nodes to 256 nodes maximum.
I think that this will be useful for LLMs and, in addition, for AI acceleration in cloud servers.
I've picked the eyes out of the article for support for the idea of Akida 2P in the cloud, but the whole article is well worth reading:
https://www.eetimes.com/arm-updates-css-designs-for-hyperscalers-custom-chips/
CSSes are Arm’s oven-ready designs that combine key SoC elements to give customers a head start when designing custom SoCs. Arm also has an ecosystem of design partners to help with implementation, if required. The overall aim is to make the path to custom silicon faster and more accessible. The recently announced Microsoft Cobalt 100 is based on second-gen CSS (specifically, CSS-N2).
...
Awad said hyperscalers choose Arm because the availability of CSSes means custom solutions can be created quickly and combined with Arm’s robust ecosystem.
“What we’re hearing from everywhere is that, generally speaking for hyperscalers and many of these OEMs, general-purpose compute is just not keeping up, meaning an off-the-shelf SoC is not keeping up,” he said. “We’re really optimistic about [CSSes] and we’ve seen tremendous traction with these platforms.”
The driver for hyperscalers’ desire to build their own chips is undoubtedly AI.
Awad said Arm has customers running AI inference at scale on Arm-based CPUs, in part down to the cost of custom accelerators, and in part down to their availability. (The market-leading data center GPU, Nvidia H100, is in notoriously short supply.) CPUs are widely available and very affordable compared with other options, he said.
...
Arm also expects its CSS designs to be used in tightly-coupled CPU-plus–accelerator designs, analogous to Nvidia Grace Hopper, which is optimized for memory capacity and bandwidth, Awad said.
CSSes don’t just work for hyperscalers; they can also support smaller companies, particularly through the Arm Total Design ecosystem of design partners, he said.
“[Smaller] companies are looking to get to market as quickly as possible to launch their solutions to capture market share, to establish themselves,” he said. “They’re also looking for a level of flexibility so that they can focus their innovation, and then they obviously need the performance to run some of these workload
Collaborative relationship
With CSS, Arm takes responsibility for configuring, optimizing and validating a compute subsystem so the hyperscaler can focus on system-level workload-specific differentiation they care about, whether that’s software tuning, custom acceleration, or something else, said Dermot O’Driscoll, vice president of product solutions for Arm’s infrastructure line of business.
“They get faster time to market, they reduce the cost of engineering, and yet they take advantage of the same leading edge processor technology,” he said. “We created the CSS program to give customers the same kind of control of the silicon stack as they have over their software and system stacks today. This is a close collaborative relationship and our partners push us really hard to raise our game.”
...
The CSS-N3 offers a 20% performance-per-Watt improvement per core over the CSS-N2. This CSS design comes with between 8 and 32 cores, with the 32-core version using as little as 40 W. It’s intended for telecoms, networking, DPU, and cloud applications and can be used with on-chip or separate AI accelerators. The new N3 core is based on Armv9.2 and includes 2 MB private L2 cache per core. It supports the latest versions of PCIe, CXL and UCIe.
I hope you would not spend your money into such a cheap quality car. But the colour is acceptable today
gilti
Regular
The cut-off time in the closing auction is supposed to be set by a random number generator between 1 & 60 seconds after 4.10 It is astounding how often in the auction the final transaction is just one share that just happens to drop the price by half a cent. The timing is fantastic. Level playing field. my arse.
mrgds
Regular
....................... quality will be the same, as Mercedes Benz will just put their badge on a chinese built EV in the years to come.Apart from Tesla, all European/American brands will be chinese EVs badged in their own brands over the next 5yrs. Sad reality unfolding now.
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