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Cadence Tools Paving the Way for the AI-at-the-Edge Transition
For machines to sense and replicate human intelligence, we must empower them with quick decision-making abilities for reliable operations even during adverse conditions. AI at the edge reduces latency by processing data generated by sensors/IoT devic...community.cadence.com
Cadence Tools Paving the Way for the AI-at-the-Edge Transition
10 May 2023 • 7 minute read

TSMC Technology Roadmap, 2023 Version
<a href="https://community.cadence.com/cadence_blogs_8/b/breakfast-bytes"></a>April brings one of the two times during the year that TSMC lays out its process roadmap, fab construction plans, and more at the TSMC Technology Symposium. The other is the Open Innovation Platform Ecosystem Forum in...

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Specialty technology is increasingly important: RF, CIS, PMIC, NVM, ULP, Auto (key: RF=radios, CIS=image sensors, PMIC=power management, NVM=non-volatile memory, ULP=ultra low power, auto=automotive).
Here are a few process names:
RF: N6RF, N6RF+, N4PRF (coming). Many customer tapeouts last year.
ULP: N22, N12e, N6e (coming).
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But TSMC also invests in new variations on those processes too. In fact, TSMC's investment in specialty technology has grown (over the last 5 years) at a CAGR of 40%. For the first time ever, it is investing in building mature technology capacity and will expand by 1.5X over the next three years (this counts the TSMC/Sony/Denso fab in Kumamoto, Japan, which is all mature technology).
- ULP solution. 55ULP, 40ULP, 22ULL (0.6-1V) N12e (0.45-1V), N6e.
- RF connectivity. N6RF offers fast er performance with 49% power consumption reduction compared to 16FFC enhancement (benchmark half analog, half digital).
- N4PRF most advanced RF CMOS technology. RF on top of logic for digital-intensive RF products. N4PRF vs N6RF logic density 1.77X, power reduction 45%
- MCU is all about how to scale non-volatile memory. MRAM and RRAM in 28nm/22nm since 2019. 16/12nmsince 2022, and 6nm in planning.
- 40RRAM And 28/22RRAM in volume production
- 28RRAM achieves >10 years 125° retention (automotive grade)
- 12RRAM to be released in 1Q2024
- 22MRAM in production
- 16MRAM consumer qualified in 2022, planned for automotive 2023.
- Achieve >1M endurance cycle, 20 years 230 degrees retention.
- Power management. Smart power IC drives BCD scaling.
- N90 BCD+ since 2021.
- N55 BCD+ SoI (pathfinding for automotive)
- N50BCD+ with RRAM
- CMOS image sensor. Resolution 50MP and beyond. Pixel size 11-1.4um. ISP (processor) N40 going to 12FFC.
- Roadmap for CIS has two logic layers with advanced packaging. Allows for AI in the logic.
What does this mean.....?
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