Hi Idd,Hi Chapman,
I generally agree with what you said but have a couple of differing opinions.
Firstly, I don't think the project manager job advertisement mentioning an immediate 2.0 launch confirms AKD2000 is tracking on time and will be ready in a few months. Assuming that AKD2000 is still going to an optimised AKD1500, this likely won't be finalised until after the first AKD1500 reference chip is back and tested. My guess is AKD2000 will be ready closer to a year from now.
Keeping in mind that this project manager job reports to the CMO, I think it's more likely to be referring to either a brand refresh or the launch of marketing for the new AKD1500 chip (job ad includes mentions of user manuals and training materials). AKD1500 will bring a lot of new functionality - hopefully transformers (which I suspect it will from the changelogs) as this will allow use cases with advanced predictive capabilities and may attract some of the attention currently focussed on ChatGPT. So with that comes a lot of great new marketing opportunities.
Secondly, while I get the potential link with Global Foundries and NASA / DARPA, I wouldn't expect the choice of GF 22nm FDSOI to be their request. A large reason for this is that governments generally take the slow but safer route. Decision making is usually slower and I also don't recall seeing any SBIRs awarded for neuromorphic / SNN transformers. In my view it's more likely that NASA will wait for the reference chip to produced, do internal testing and then decide what they want to do with it. I'm also not convinced they would care about such a low nm node size.
My guess is it's more likely to be a request from the other EAPs like Mercedes, one of the most advanced early adopters. The below link about a joint STMicro and GF facility offers some perspective in favour of this.
Pure speculation, DYOR
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STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France | GlobalFoundries
New jointly-operated, high-volume manufacturing facility to support European and global customers’ demand as the world transitions to digitalization and decarbonization […]gf.com
“This new manufacturing facility will support our $20 billion+ revenue ambition. Working with GF will allow us to go faster, lower the risk thresholds, and reinforce the European FD-SOI ecosystem. We will have more capacity to support our European and global customers as they transition to digitalization and decarbonization” said Jean-Marc Chery, President and CEO of STMicroelectronics. “ST is transforming its manufacturing base. We already have a unique position in our 300mm wafer fab in Crolles, France which will be further strengthened by today’s announcement. We continue to invest into our new 300mm wafer fab in Agrate (near Milan, Italy), ramping up in H1 2023 with an expected full saturation by end 2025, as well as in our vertically integrated silicon carbide and gallium nitride manufacturing.”
“Our customers are seeking broad access to 22FDX® capacity for auto and industrial applications.
You are correct that, in the past NASA has opted for proven technology, but in the last week or so someone posted a NASA SBIR calling for 22nm FD-SOI and complaining about the wasted silicon in having a built-in processor - pretty much what Akida 1500 provides.
Akida 1000 has an ARM Cortex (licenced from ARM) and several comms interfaces, none of which form part of the Akida IP.
It may be that, for a specific purpose, only one comms interface would be needed.
Such a pared down Akida would need an off-chip processor for configuration, but this would not significantly affect performance as Akida does not need any processor for inference, and, if memory serves, no more than 5% of CNN2SNN processing is done on the processor.
This frees up Akida to work with SiFive, Intel or any other processor without the need to pay an additional licence royalty to ARM. It also reduces the silicon footprint so more Akida 1500s can fit on a wafer.
The Akida IP includes the NN array and the CNN2SNN conversion hardware, and the configuration software.
The US DoD has reacted to the Sino-Russian situation. The US has a new Chips Bill compelling Intel and others to repatriate chip manufacturing.
That said, your STM article indicates that there is significant demand for the GF tech from industry as well.
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