"Started by a powerful consortium of Intel, AMD, Arm, Qualcomm, Samsung, Google, Meta, and Microsoft, as well as chipmakers TSMC and ASE, UCIe builds on the CXL and PCIe 5.0 standards and defines the physical (interconnect) and logical (software) standards by which companies can start designing and building the chips of their dreams.
Want to mix an Intel CPU with an AMD GPU, a Qualcomm modem, a Google TPU AI accelerator (or AKIDA
) and a Microsoft Pluton security processor onto a single chip package, or system on package (SOP)? When UCIe-based products start to get commercialized in say the 2024-2025 timeframe, thatβs exactly what you should be able to do.
Not only is this technologically and conceptually cool, but it also opens a whole new range of opportunities for chip companies and device makers and creates many new types of options for the semiconductor industry as a whole. For example, this could enable the creation of smaller yet still financially viable semiconductor companies that only focus on very specialized chiplets or who only concentrate on putting together interesting combinations of exiting parts made by others.
For device manufacturers, this theoretically allows them to build their own custom chip design without the burden (and cost) of an entire semiconductor team. In other words, you could create an Apple-level of chip specificity at what should be a significantly lower development cost."
With the above thought in mind, let me explain why a seemingly modest announcement about a new industry consortium and semiconductor industry standard, called Universal Chiplet Interconnect...
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