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DuPont de Nemours, Inc. DD recently launched SOLDERON BP TS 7000, the latest innovation in tin-silver plating chemistry, at the IEEE Electronic Components and Technology Conference (ECTC), in Orlando, FL.
The industrial drive toward smaller, more powerful semiconductor chips is boosting innovative advances in packaging applications such as 2.5D and 3D chip packages. To obtain tighter interconnections and higher circuit density for microbump applications, regulated plating homogeneity, smoothe...
>>> Read more: DuPont (DD) Launches New Advancement in Plating Chemistry
The industrial drive toward smaller, more powerful semiconductor chips is boosting innovative advances in packaging applications such as 2.5D and 3D chip packages. To obtain tighter interconnections and higher circuit density for microbump applications, regulated plating homogeneity, smoothe...
>>> Read more: DuPont (DD) Launches New Advancement in Plating Chemistry
